EN IEC 61189-2-808 EUROPEANSTANDARD NORMEEUROPEENNE EUROPAISCHE NORM May 2024 ICS 31.180 English Version Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method (IEC 61189-2-808:2024) Prufverfahren fur Elektromaterialien, Leiterplatten und Methodes d'essaipourles materiauxélectriques,les cartes imprimees et autres structures et assemblages andere Verbindungsstrukturen und Baugruppen - Teil 2- d'interconnexion - Partie 2-808 : Resistance thermique d'un 808: Thermischer Widerstand der dielektrischen Schicht assemblage par la methode du transitoire thermique durch thermische transiente Methode (IEC 61189-2-808:2024) (IEC 61189-2-808:2024) This European Standard was approved by CENELEC on 2024-05-30. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibilityof aCENELEC member into its own language andnotifiedtothe CEN-CENELEC ManagementCentre has the same status as the official versions. CENELEC members are the national electrotechnical committees ofAustria,Belgium, Bulgaria, Croatia, Cyprus,the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland Turkiye and the United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comite Europeen de Normalisation Electrotechnique Europaisches Komitee fir Elektrotechnische Normung CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels @ 2024 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN IEC 61189-2-808:2024 E ENIEC 61189-2-808:2024 (E) European foreword The text of document 91/1935/FDIS, future edition 1 of IEC 61189-2-808, prepared by IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by CENELECasENIEC61189-2-808:2024. The following dates are fixed: latest date by which the document has to be implemented at national (dop) 2025-02-28 latest date by which the national standards conflicting withthe(dow) 2027-05-30 document have to be withdrawn Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights completelistingofthesebodiescanbefoundontheCENELECwebsite. Endorsement notice The text of the International Standard IEC 61189-2-808:2024 was approved by CENELEC as a European Standard without any modification 2 ENIEC61189-2-808:2024 (E) Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. Fol undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cencenelec.eu. Year Publication Year Title EN/HD IEC 60194-2 Printed boards design, manu